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3008b crack2b3010a
Pict. 1 (electr. micr. photo) – crack easy to detect with a „new“ PCD blank Pict. 2 (electr. micr. photo) – crack to detect
under magnification with a „new“ blank
32867a 32874a
Pict. 3 (electr. micr. photo) –  crack after sintering,
sintering material fills the gap in the PCD
Pict. 4 (electr. micr. photo) –  Detected while
ultrasonic treatment: cavity in the structure
m4100008korn_a fehler_727a
Pict. 5 (light-optical microscope) Detected during ultrasonic shaping: punctual defect in the pcd structure and crack in the drawing cone Pict. 6 (light-optical microscope) Similar pict. 5 Crack in the entrance area

Since the beginning the wire die manufacturers could detect faulty material with the PCD.

These defects occur during the process of manufacturing (laser drilling, ultrasonic shaping and polishing).

But also while using the PCD tools in the drawing process (breakage of the wire, defect of the die or both).

Defects shown in the pictures on the right are all found in pcd products of well-known manufacturers.

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